Advanced systems on chips

Large electronics partnership to tackle advanced systems on chips

August 5, 2009

Large electronics partnership to tackle advanced systems on chips

In a move that addresses fundamental challenges in creating advanced systems-on-chips (SoCs), ARM, Chartered Semiconductor Manufacturing, IBM , Samsung Electronics  and Synopsys today announced at the Design Automation Conference (DAC) an agreement to develop a comprehensive technology enablement solution for the design and manufacture of mobile Internet-optimized devices.

The objective of this collaboration is to leverage innovations in material science, mobile multimedia implementation and SoC design to lower risk and improve time-to-market for advanced mobile products.

This complete design chain collaboration of technology leaders intends to integrate the following components:

ARM(R) high-performance, low-power processor architecture for mobile applications, and optimized suite of physical intellectual property (physical IP) 32/28-nanometer (nm) low-power/low-leakage, high-k metal-gate (HKMG) synchronized foundry services through the Common Platform manufacturing alliance of IBM, Chartered and Samsung Synopsys Lynx Design System, including Galaxy(TM) Implementation Platform for SoC implementation, as well as DesignWare(R) connectivity IP As semiconductor technology approaches fundamental physical limits and design complexity reaches unprecedented levels, a deeper type of technical alignment is essential.

“The Common Platform alliance’s expanded engagement approach with ARM, and now Synopsys, means working more closely together with earlier access to each other’s technology innovations, integrating and optimizing our capabilities for clients,” said Michael J. Cadigan, general manager, IBM Microelectronics Division, on behalf of the Common Platform alliance companies. “The benefits are clear and differentiated: lower risk, lower cost and faster time-to-market.”

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