IBM involved in a deal to distribute broadband over electricity networks
IBM today announced that it has recently reached a new financing arrangement that would help accelerate customer access to high speed Internet in rural areas.
The funding agreement would benefit Broadband over Power Line (BPL) technology provider International Broadband Electric Communications, Inc. (IBEC) and one of its leading integrated chip (IC) suppliers, DS2. IBEC has developed technology that would deliver broadband access over electric power lines.
“IBM Global Financing is proud to play a part in the financing of smart projects that lead to eventual economic recovery,” said John Callies, general manager of IBM Global Financing, Worldwide. “Spurring investments in communications and information technology infrastructure like Broadband over Power Lines can not only provide a boost to the U.S. economy, but also lay the groundwork for long-term economic growth and significant improvement in Americans’ quality of life.”
Growing businesses often benefit from financing lines to push forward smart and innovative technology projects and bridge the time period between the delivery of goods and payment. IBM Global Financing can help well-qualified small businesses get paid earlier and bolster their business cycle.
“Broadband over Power Line clearly is one of the technologies that should be included as part of the effort to expand broadband services to un-served and underserved markets in the U.S.,” said Vince Vittore, Principal Analyst, Yankee Group. “This jump start in financing by IBM Global Financing is exactly the type of effort that will allow BPL to be an integral part of bringing the benefits of broadband to consumers and businesses that have been left out of the most important communications trend of the last decade.”